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Mobile Phone Cooling Plate Heat Sink Expend Cooling Area Mobile Phone Semiconductor Cooler Back-clip Magnetic Radiator
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Mobile Phone Cooling Plate Heat Sink Expend Cooling Area Mobile Phone Semiconductor Cooler Back-clip Magnetic Radiator
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Mobile Phone Cooling Plate Heat Sink Expend Cooling Area Mobile Phone Semiconductor Cooler Back-clip Magnetic RadiatorSPECIFICATIONS Batteries Included: No Brand Name: NoEnName_Null Cooling method: semiconductor Hign concerned Chemical: None Input current: 3A Input voltage: 5V Installation method: magnetic suction back clip Main material: ASB + aluminum alloy + cooling sheet Origin: Mainland China,Mainland China Power supply method: Type C Power supply size: 5V 3A Product size: 105. 00x60. 00x30. 00mm 4. 13x2. 36x1. 18inch Product weight: 169g Mobile Phone Cooling
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SPECIFICATIONS
Batteries Included: No
Brand Name: NoEnName_Null
Cooling method: semiconductor
Hign-concerned Chemical: None
Input current: 3A
Input voltage: 5V
Installation method: magnetic suction / back clip
Main material: ASB + aluminum alloy + cooling sheet
Origin: Mainland China,Mainland China
Power supply method: Type-C
Power supply size: 5V/3A
Product size: 105.00x60.00x30.00mm/4.13x2.36x1.18inch
Product weight: 169g
Mobile Phone Cooling Plate Heat Sink Enhanced Heat Dissipation Semiconductor Phone Cooling Plate Back-clip Magnetic Radiator
Features:
1. Advanced Cooling Technology, Protects Device: Built-in intelligent temperature control chip maintains low phone temperature. Phone cooling pad heatsink uses TEC semiconductor cooling chip for efficient cooling without compromising on quality.
2. Larger Cooling Surface, Full Device Cooling: Mobile phone cooling plate heat sink precisely fits CPU heat source, covering most of the CPU area. L-shaped cooling surface targets the heat source directly, ensuring a cool touch even during long gaming sessions.
3. Magnetic and Clip-On Modes: Easily switch between magnetic attachment and clip-on modes. Smartphone cooler cooling pad includes a clip for phones without magnetic capability, ensuring versatile use.
4. Three Adjustable Levels, Real-Time Temperature Display: Three different temperature settings with easy one-button adjustment. Semiconductor phone cooling plate is equipped with a digital display module for real-time temperature monitoring. Three-color gaming lights enhance the gaming atmosphere.
5. Lightweight and Unobtrusive, Only 89g: Compact design of mobile phone semiconductor cooler does not obstruct gameplay. Lightweight and portable, ensuring comfort during extended gaming sessions. Includes a 1/4-inch screw port for easy installation on live streaming stands, providing smooth, low-temperature streaming.
Specification:
Origin: Mainland China
Cooling method: semiconductor
Main material: ASB + aluminum alloy + cooling sheet
Installation method: magnetic suction / back clip
Power supply method: Type-C
Power supply size: 5V/3A
Input voltage: 5V
Input current: 3A
Product weight: 169g
Product size: 105.00x60.00x30.00mm/4.13x2.36x1.18inch
Note:
Due to the different monitor and light effect, the actual color of the item might be slightly different from the color showed on the pictures. Thank you!
Please allow 1-2cm measuring deviation due to manual measurement.
Features:
1. Advanced Cooling Technology, Protects Device: Built-in intelligent temperature control chip maintains low phone temperature. Phone cooling pad heatsink uses TEC semiconductor cooling chip for efficient cooling without compromising on quality.
2. Larger Cooling Surface, Full Device Cooling: Mobile phone cooling plate heat sink precisely fits CPU heat source, covering most of the CPU area. L-shaped cooling surface targets the heat source directly, ensuring a cool touch even during long gaming sessions.
3. Magnetic and Clip-On Modes: Easily switch between magnetic attachment and clip-on modes. Smartphone cooler cooling pad includes a clip for phones without magnetic capability, ensuring versatile use.
4. Three Adjustable Levels, Real-Time Temperature Display: Three different temperature settings with easy one-button adjustment. Semiconductor phone cooling plate is equipped with a digital display module for real-time temperature monitoring. Three-color gaming lights enhance the gaming atmosphere.
5. Lightweight and Unobtrusive, Only 89g: Compact design of mobile phone semiconductor cooler does not obstruct gameplay. Lightweight and portable, ensuring comfort during extended gaming sessions. Includes a 1/4-inch screw port for easy installation on live streaming stands, providing smooth, low-temperature streaming.
Specification:
Origin: Mainland China
Cooling method: semiconductor
Main material: ASB + aluminum alloy + cooling sheet
Installation method: magnetic suction / back clip
Power supply method: Type-C
Power supply size: 5V/3A
Input voltage: 5V
Input current: 3A
Product weight: 169g
Product size: 105.00x60.00x30.00mm/4.13x2.36x1.18inch
Note:
Due to the different monitor and light effect, the actual color of the item might be slightly different from the color showed on the pictures. Thank you!
Please allow 1-2cm measuring deviation due to manual measurement.
1 x Radiator
1 x Back clip
1 x Power cord
1 x Back clip
1 x Power cord
Mobile Phone Cooling Plate Heat Sink Expend Cooling Area Mobile Phone Semiconductor Cooler Back-clip Magnetic Radiator
Item no
:
97147501259
US$ 32.28
Pay in 4 interest-free payments of $8.07 Learn more
Min. order:
1piece
Shipping Estimate
USA
- USA
- CAN
- USA
- CAN
Ships within 48 hours · Estimated delivery Jun 21 - Jun 26
US$40
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- Free Standard Shipping on $100+ Orders to the USA.
- Except Preorder products are shipped in 48 hours.
- Delivery to the USA:
- Standard Shipping : 3-10 business days
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Exchange/Return Notes
- We offer a 30-day return/exchange service after receiving.
- Final sale items are not eligible for returns or exchanges.
- To process your return/exchange, please contact us at [email protected]
- Please click here for more details>>> Return & Exchange Policy
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