EP2010 – Ultra Clear Resin 

TDS: Technical Data Sheet

• 8,867 cP viscosity
• Ideal for visible electronics and encapsulation requiring clarity

Engineered for precision and performance, EpoxyPro EP2010 is a mid-viscosity, ultra-clear epoxy resin ideal for electrical potting, visible electronics, and high-clarity encapsulation.

With a mixed viscosity of 8,867 cP and a 2:1 mix ratio, it delivers excellent flow around complex components while offering superior dielectric strength (24 kV/mm), high compressive strength (90 MPa), and thermal resistance up to 150°C. Perfect for sealing cable joints, transformers, sensors, and circuit boards. EP2010 ensures long term protection against moisture, vibration, and harsh industrial conditions.

Key Features:

• Crystal-clear finish for visible electronics and sensor encapsulation
• Strong dielectric properties with mid-viscosity for excellent flow control
• Bonds to metals, plastics, and electronic substrates
• Moisture, vibration, and chemical resistant
• Suitable for casting, encapsulating, and small component sealing
• 2:1 resin-to-hardener ratio for reliable curing
• Ideal for display-grade applications where clarity and durability are essential

Ideal For:

• Visible PCB and sensor encapsulation
• Coils, transformers, and circuit protection
• Potting clear sensor heads and lighting modules
• Small switchgear and electronic housings
• Long-term protection in moderately harsh environments